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FX10/FX11 Series, 0.5mm pitch, board to board connectors from Hirose are suitable for high speed applications
The series has the capacity to accept 10 Gbps transmission speed making them suitable for SATA, USB 2.0 and PCI express applications.
Bourns releases non-contacting Hall effect sensor
Bourns has announced a new non-contacting, single turn Hall effect sensor, the highly versatile AMS22S Series, designed to meet the specifications of heavy duty applications requiring long cycle life and high reliability.
STMicroelectronics increases presence in RF power market with new device family leveraging advanced proprietary technology
STMicroelectronics has announced new radio-frequency (RF) power transistors built using an advanced technology that increases performance, ruggedness and reliability in vital demanding applications.
Cree launches new high performance XLamp® XT-E Royal Blue LED and patent licensing program for remote phosphor applications
Optimised for use in remote phosphor lighting and other applications with similar requirements, the new XLamp XT-E LED delivers the industry's tightest wavelength bins with category leading brightness to simplify designs and lower system costs.
V-ZA series from Panasonic combines the advantages of both electrolytic and polymer capacitors
Panasonic's newly developed hybrid technology (introduced as V-ZA series) brings together the low ESR characteristics of specialty polymer capacitors with the low leakage current of aluminium electrolytic capacitors.
Micro-miniature pushbutton switches from knitter-switch are just 1.48mm high
knitter-switch has introduced a very small, tactile, pushbutton switch that will find many applications in all types of handheld devices including those designed for medical and industrial use.
Hitachi's latest 8.0 inch WVGA high brightness TFT has LED backlight with user brightness control
Hitachi Display Products Group (DPG) has announced the introduction of a new compact 8.0" wide aspect ratio TFT display module, the TX20D28VM2BAB, offering a display resolution of 800 x 480 pixels (WVGA) and an integrated LVDS data interface.
Cinterion launches PHS8 the world's thinnest HSPA+ module for M2M applications
At just 2 mm in height, PHS8 is ideal for the most space-constrained M2M solutions. The fully ruggedised, high-bandwidth module provides flexible surface mounting, secure high-speed voice and data communications, and a reliable path to LTE.
Piher's new fully featured rotary sensor offers a small package and cost effective alternative to encoder technology
Piher has announced the immediate availability of a new shaft angle rotary sensor - the PST-360 Through-Hole Position Sensor. The PST-360 combines a through-shaft design with 360° absolute position feedback in an extremely thin package.
STMicroelectronics enables new consumer conveniences with combination of innovative wireless memory and NFC technology
STMicroelectronics has announced the strengthening of its position in the Near-Field Communication (NFC) market by extending user's ability to read, write and transfer information on ST's dual-interface Memory to a broad range of applications.
Calinar adds thermal interface materials to their extensive portfolio
Recognised for their wide selection of high quality heatsinks for cost conscious designs, Calinar have now introduced a range of complementary thermal interface materials comprising of sheets, pads, sleeves and hoods.
AVX expands leaded M123 Series to provide 1uF values
AVX has expanded its space-level M123 Series of ceramic capacitors to provide 1uF values, in both moulded radial and DIPGuard® configurations, for applications where high performance and superior reliability are required.
Articles 1297 to 1308 of 2041
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