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Cinterion announces advanced wireless modules for telematics and eCall applications
Cinterion has recently announced its sixth generation of automotive grade modules, the AC65i and AC75i, which are fully approved for worldwide GSM networks hastening the time to market.
Schurter SMD fuse with clips saves space and adds versatility to design
Schurter’s original IEC 60127-4 Universal Modular Fuse, series UMT 250, is now offered in a convenient package to simplify fuse replacement. The new fuse and fuseholder combination is dubbed the UMZ 250.
Low-power silicon oscillator from STMicroelectronics saves parts-count and streamlines design
The STCL1120 family of silicon oscillators from STMicroelectronics combines fast start-up and high immunity to shock, vibration and EMI with lower operating current and a chip-select control.
Cree announces XLamp performance breakthrough with their new XP-E colour LEDs
Cree has expanded its industry-leading XLamp® XP-E range to include the highest performance family of discrete, high-power colour LEDs available.
AVX develops the industry’s smallest 0.4mm pitch board-to-board connector
Designated the 5802 Series, the low-profile 10 to 60 position connector family is ideal for portable devices due to their unique design that combines ultra-small size with high-reliability.
ROHM Semiconductor presents new small and high accuracy temperature sensor ICs
ROHM Semiconductor has introduced a new series of thermostat and analog temperature sensors integrating a temperature detection element, constant current circuit, comparator, and high-accuracy reference voltage source in a single chip.
DF12 series, 0.5mm pitch, surface mount board to board connectors from Hirose offering excellent features and benefits
This connector range features fine pitch receptacles and headers that have been designed with space saving in mind to meet the high demand for miniaturisation, in applications such as wireless modules.
ESD protection for high-speed data lines with CeraDiodes by EPCOS
EPCOS now offers CeraDiodes® in 0402 and 0603 corresponding to Zener and TVS diode case sizes. They are distinguished by extremely low capacitances, with typical values of 0.6 pF, and an extremely fast response time of less than 0.5 ns.
The first LGA M2M modules from Cinterion are now in production
Including all necessary approvals for global coverage, the EES3 Wireless Module is one of the world’s smallest EDGE modules that addresses high-speed data transfers in GSM networks with demand for flexibility and scalability.
Cree announces industry's first red-green-blue-white multichip LED with the XLamp MC-E colour
Cree has expanded its high-power colour LED product offerings by unveiling the industry’s first multichip MC-E LED with red, green, blue and white chips—all in a single package.
STMicroelectronics expands STM32 options with lower flash-density devices and new 48MHz USB access line
STMicroelectronics has further extended options for users of its STM32 MCUs, by introducing new devices with 16 Kbyte Flash density as well as a complete new 48MHz series of microcontrollers optimized for USB applications.
Schurter introduce the DD11 and DD12 compact power entry modules for safe power input
Schurter’s new power entry modules, series DD11 and DD12, are designed to be extremely compact and robust. The DD11 is equipped with multiple functions including an IEC C14 appliance connector, switch and fuseholder.
Articles 1657 to 1668 of 2041
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