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Introducing the FunctionMAX family of board-to-board connectors from Hirose with floating contacts and support for high-speed data transmission, samples available from Anglia.

The FunctionMAX family of connectors from Hirose are Board-to-Board connectors Engineered for the demands of modern electronics systems, Hirose's FunctionMAX connectors redefine board-to-board connections.

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Aavid Thermalloy introduces new Slalom SMT heatsink

Aavid Thermalloy has announced the new Slalom heatsink (patent pending) suitable for SMT power semiconductor devices in D2PAK packages.

This new heatsink, which is compatible with current D2PAK solder mask opening, uses solderable “skis” that are staked to an aluminium body. The heatsink together with the device to be cooled is soldered directly to a modified drain pad creating a thermal transfer path from the device to the heatsink. The heat is removed indirectly without any contact between the heatsink and the device as is the case with traditional through hole heatsinks. Additionally the aluminium heatsink body has a black painted finish that provides improved radiation cooling over standard tin plated copper SMT heatsinks. Using aluminium instead of copper also results in lower cost and weight making this technology ideal for high volume pick & place equipment.

Features and benefits:

Increased thermal performance up to 30% over bright copper
heat sinks from improved radiation of the black finish
Unique aluminium design reduces the heat sink cost
versus similar designs utilizing copper
Light weight aluminium construction allows faster pick
and place assembly reducing the manufacturing cycle time
The black finish provides enhanced heat absorption,
improving Infra-red reflow process cycle time and quality
Edge mounted “Skis” are designed for use in applications
with limited PC board space and allow customisation of
footprint design and size
Available in bulk packaging or Tape & Reel

Applications: