AVX Corporation has developed a new termination style for MnO2 (TLN Series) and polymer (TCN Series) tantalum capacitors that reduces the required internal construction space by up to 60 per cent and enables parts to be positioned very closely together.

In the new configuration, ‘J’ leads are replaced by ‘undertab’ terminations that do not protrude outside of the outline of the case. This design not only increases volumetric efficiency, but also allows printed circuit board (PCB) footprint pads to be spaced only slightly wider than the part itself.

This package construction features a second electrode, which results in a lower self inductance (ESL), enabling a better working frequency range. Ignition resistance is also significantly improved with polymer TCN Series version.

The new undertab termination design significantly reduces the footprint on the PCB, while increasing performing characteristics. The reduction in size and space makes the TLN and TCN Series tantalum capacitors ideal for any application that requires component miniaturization.

Available in low profile packaging, the smallest devices measure just 1mm in height. The planned capacitance range is 22 - 680µF (+/- 20%), and working voltage range 4-10V. The first devices available are the TLN S case (1206, 1.2mm max height) 220µF 4V product, and TCN L case (1210 1.0mm max height) 150µF 6.3V capacitor. Devices are suitable for 3x 260˚C reflow solder processing.

The capacitors are designed for use in any application that requires high capacitance in a miniature package, particularly consumer products such as handheld devices, mobile phones and MP3 players, as well as suit power line and audio circuit designs.

For more information, or details on the full range of AVX products available from Anglia, please call +44 (0)1945 474747 or email info@anglia.com

Alternatively, click on this link to go to the main AVX section where you can view other news articles and product data.

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