Anglia Components |
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Intersil’s additions to power module family simplify design, lower risk and accelerate time-to-market
The products are footprint compatible with Intersil’s recently announced ISL8201M, giving designers the flexibility to fix their point-of-load (POL) power requirements much later in the design cycle and optimize system power needs without having to re-layout the PCB. This family of modules is ideal for computing, telecommunications and networking infrastructure, and industrial products. As system power performance requirements increase, so do the design risks. The ISL8204/06/01M deliver high performance without the risk. And with fewer components, reliability in the field is improved as well. The ISL8204/06/01M’s compact 15mm x 15mm x 3.5mm package consumes very little PCB area. With the thermally enhanced QFN package, heat is dissipated through the bottom of the package, which frequently eliminates the need for a bulky heat sink or cooling fan. Unlike some competing power modules, the ISL8204/06/01M are assembled in surface-mount QFN packages with leads around the perimeter. This provides more reliable soldering, solder-quality inspection and easy access with oscilloscope probes. For more information, or details on the full range of Intersil products available from Anglia, please call +44 (0)1945 474747 or email info@anglia.com
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This news article was originally published in April 2010.
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13/4/10