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IT3 series high-speed (10+Gbps) ball grid array (BGA) mezzanine connectors
IT3 is as comfortable in today's data rates of PCIe and XAUI as it is in tomorrow's 10+ Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 - 40mm, IT3 can solve your interface needs for both current and future generations. Features and Benefits The IT3’s divided receptacle structure reduces thermal stress and ensures long term reliability of the BGA ball connection with the printed circuit board. The receptacle contact is strategically positioned into the solder ball preventing peel off and allowing greater protection against severe shocks and vibration. The mating contacts feature a pre-load structure that gives lower insertion and extraction forces ensuring a smoother mating and unmating operation. The innovatively styled housing prevents the exposure of the contacts to minimise damage. Mechanical Features
Signal Integrity Features
The ICR performance meets the extrapolated IEEE 802.3ap specification for 6.25Gbps with fully-populated pin assignment, and 10+ Gbps with skipped pin assignment. Return Loss The differential return loss meets the extrapolated IEEE 802.3ap specification up to 12GHz Applications Suitable application are servers, industrial controller units, medical devices, base transmission station, internet routers and switches. For more information, please contact us. For more information, or details on the full range of Hirose products available from Anglia please call +44 (0)1945 474747 or email info@anglia.com |
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This news article was originally published in November 2010.
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