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Digi International introduces the powerful and secure Digi ConnectCore® MP1 module based on the STM32MP1 series microprocessor. Development kit available from Anglia.
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Overview
Boyd’s thermal solutions cover a wide range of applications and devices and employ a variety of unique technologies from Off-the-shelf cooling solutions for standard electrical packages, such as TO-220, TO-3, DIP and many others to complete cooling solutions for popular microprocessors, including interface material and attachment methods.