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Introducing the STM32H7R/Sxx8 line of scalable and secure bootflash-microcontrollers from STMicroelectronics opening new innovation possibilities.
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NICHICON CORPORATION has developed the PCL Series of chip-type conductive polymer aluminium solid electrolytic capacitors for industrial equipment requiring long life and reliability.
The J Series 2835 LEDs extend Cree's industry-leading portfolio of lighting-class LEDs to a broader set of applications, with high efficacy and excellent value in an industry-standard 2.8 x 3.5 x 0.7 mm package.
Calinar has launched a range of pin-fin heat sinks primarily designed to meet demanding LED cooling applications in the solid state lighting industry.
01 October 2018
Littelfuse's range of thermally protected Surge Protective Devices are self-protected modules specially designed to be used in outdoor and commercial LED lighting fixtures for transient overvoltage protection.
10 July 2018
The TMF300x series from Taicom have been designed to provide an array of mating options in both wire-to-wire and wire-to-board applications.
Cree has expanded the XLamp High Current LED Array family with new CMT LEDs that extend Cree's latest metal-based chip-on-board (COB) LED technology to the most prevalent COB form factors.
16 April 2018
Cree have expanded the J Series family of Mid Power lighting-class LEDs, the extended range opens up Cree's industry-leading portfolio of LEDs to a broader set of applications
12 September 2017
STMicroelectronics have created an STM32 Nucleo pack for LoRa™ technology utilising a high-performance FSK/OOK RF transceiver modem. The P-NUCLEO-LRWAN1 development tool allows engineers to learn and develop solutions based on LoRa™ and FSK/OOK.
01 September 2017
The drivers feature adjustable output currents of 0.1mA to 65mA (TSCR40 series) or 10mA to 300mA (TSCR42 series) and integrate the transistor, diodes and resistors into a single device which simplifies the system design by reducing component count.
The Soft-PGS material is ideal for applications where good thermal performance is critical such as interfacing high power IGBT modules to heatsinks.
