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HARTING offers extended range of cables and assemblies
HARTING has extended its range of interconnection solutions with the introduction of several new standard and customer-specific cables and cable assemblies.
High power density CompactPCI™ power supplies from MurataPS deliver full power across temperature range with high efficiency
Murata Power Solutions has introduced three new PICMG 2.11 compliant CompactPCI™ high reliability power supplies with a 3U form factor and efficiency levels in excess of 80%, are hot-swap capable and require no minimum load.
Anglia adds M2M comms capability with Cinterion
Anglia has signed a UK and Ireland distribution agreement with the world’s leading manufacturer of GSM and GPRS modules, Cinterion – formerly Siemens Wireless Modules.
High junction-temperature TRIACs from STMicroelectronics enable smaller heatsinks and higher power density
STMicroelectronics has announced a new series of high-temperature TRIACs, which maintain full specified performance up to a junction temperature of 150°C, whilst delivering outstanding turn-off capability.
STMicroelectronics expands (U)SIM Card IC offering with two new 32-bit ARM-Based families
STMicroelectronics has introduced two new product families for cellular-phone SIM cards. The features enabled by the two new families will allow mobile network operators to enhance differentiation and expand revenue growth.
TDK's miniature chip varistor with BGA terminals offers 33% saving in board mounting area
TDK Electronics Europe has introduced the AVF26BA12A400R201, a miniature chip varistor that uses a Ball Grid Array (BGA) terminal arrangement to reduce board mounting area by 33%.
New ceramic chip capacitors from TDK offer highest capacitance for 100V applications
TDK Electronics Europe has announced the introduction of a new generation of 100V-rated ceramic chip capacitors that offers the industry’s highest level of capacitance for mid-voltage applications in devices half the size of their predecessors.
New chip inductors from TDK offer best impedance in a 1005 device
TDK Electronics Europe has announced the MMZ1005-E series, a family of three Gigaspira multilayer gigahertz-band chip bead inductors offering the world’s highest impedance in a 1005-size device.
EPCOS Inductors: miniaturized high-current version
With its new high-current version, the SIMID 1210-H, EPCOS has made a significant step forward in the miniaturization of SMT inductors.
HARTING introduce a new 3-pin connector for IDC termination
HARTING has introduced a new version of its M8 3-pin male connector using the HARAX insulation displacement connection (IDC) fast termination technique.
New POLA DC/DC power converters from Murata-PS offer designers a choice of 6A, 10A and 15A versions
Murata Power Solutions has launched its new range of adjustable, non-isolated, Point-of-Load-Alliance (POLA) DC/DC Converters.
Ultra-low profile 80A voltage regulator modulefrom Murata Power Solutions has industryleading installed height of just 0.807in (20.5mm)
Murata Power Solutions has added a new model to its VR110 Series of single inline packaged (SIP) voltage regulator modules (VRMs) to address applications where component height is restricted.
Articles 1765 to 1776 of 2041
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